JPS6233345Y2 - - Google Patents
Info
- Publication number
- JPS6233345Y2 JPS6233345Y2 JP16372182U JP16372182U JPS6233345Y2 JP S6233345 Y2 JPS6233345 Y2 JP S6233345Y2 JP 16372182 U JP16372182 U JP 16372182U JP 16372182 U JP16372182 U JP 16372182U JP S6233345 Y2 JPS6233345 Y2 JP S6233345Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- flat package
- delay line
- circuit
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 239000003990 capacitor Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 11
- 238000001721 transfer moulding Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Filters And Equalizers (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16372182U JPS5967947U (ja) | 1982-10-28 | 1982-10-28 | 混成回路 |
| US06/448,630 US4506238A (en) | 1981-12-14 | 1982-12-10 | Hybrid circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16372182U JPS5967947U (ja) | 1982-10-28 | 1982-10-28 | 混成回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5967947U JPS5967947U (ja) | 1984-05-08 |
| JPS6233345Y2 true JPS6233345Y2 (en]) | 1987-08-26 |
Family
ID=30359148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16372182U Granted JPS5967947U (ja) | 1981-12-14 | 1982-10-28 | 混成回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5967947U (en]) |
-
1982
- 1982-10-28 JP JP16372182U patent/JPS5967947U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5967947U (ja) | 1984-05-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4506238A (en) | Hybrid circuit device | |
| JP4731021B2 (ja) | 半導体装置の製造方法および半導体装置 | |
| JP3522577B2 (ja) | コモンモードチョークコイル | |
| EP0311418B1 (en) | Composite bead element | |
| JPS6233345Y2 (en]) | ||
| JPH0214770B2 (en]) | ||
| JPH0211769Y2 (en]) | ||
| JP3546926B2 (ja) | 電子部品の製造方法と同電子部品用座板 | |
| JP2650146B2 (ja) | 複合部品の製造方法 | |
| JPH0354432Y2 (en]) | ||
| KR900008256Y1 (ko) | 평면 부착형 다연결 인덕터 | |
| JPH025491Y2 (en]) | ||
| JPS5889953U (ja) | 混成回路 | |
| JPH0129979Y2 (en]) | ||
| JPH066613Y2 (ja) | チップ形ｌｃフィルタ | |
| JPH0438574Y2 (en]) | ||
| JPH0353455Y2 (en]) | ||
| JPH0447969Y2 (en]) | ||
| JPH0438575Y2 (en]) | ||
| JPH0130786Y2 (en]) | ||
| JPH0447967Y2 (en]) | ||
| KR970003196Y1 (ko) | 디바이스의 구조 | |
| JPS6341005A (ja) | 複合電子部品 | |
| JPH0510413Y2 (en]) | ||
| JPS6344965Y2 (en]) |